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Trạm hàn Chipset tự động BGA ZHUOMAO ZM-R8650



Tích hợp màn hình LCD cảm ứng điều khiển, Camera căn chỉnh
Tổng công suất: 9800W
Công suất: AC220V±10%     50/60Hz
Bộ nhiệt trên:1200 W
Bộ nhiệt dưới: 1200 W
Bộ nhiệt IR: 7200 W
Định vị: rãnh V, Hỗ trợ PCB
Kích thước PCB : Max 500*600mm  Min 10*20 mm
Kích thước chip: 2×2-80×80mm
Thiết bị điện: Servo Drive( Panasonic)+Industrial Host+ Heating plate(Germany)
Hệ thống quang học: Servo Drive + hệ thống liên kết hình ảnh tự động(Panasonic)
Kích thước: 1100*1300*1700mm( không tính LCD stand )
Cảm biến nhiệt ngoại : 5pc
Trọng lượng tịnh: 400 kg

Chi tiết

Option Nozzle:
- Nozzle  8x8mm : 1,125,000 VNĐ
- Nozzle 10x10mm  : 1,125,000 VNĐ
- Nozzle 12x12mm  : 1,125,000 VNĐ
- Nozzle 15x15mm  : 1,125,000 VNĐ
- Nozzle 18x15mm : 1,125,000 VNĐ
- Nozzle 20x20mm : 1,125,000 VNĐ
- Nozzle 24x24mm : 1,125,000 VNĐ
- Nozzle 25x25mm : 1,125,000 VNĐ
- Nozzle 28x28mm : 1,125,000 VNĐ
- Nozzle 31x31mm : 1,125,000 VNĐ
- Nozzle 35x35mm : 1,125,000 VNĐ
- Nozzle 36x36mm : 1,125,000 VNĐ
- Nozzle 38x38mm : 1,125,000 VNĐ
- Nozzle 41x41mm : 1,125,000 VNĐ
- Nozzle 45x45mm : 1,125,000 VNĐ
- Nozzle 48x48mm : 1,125,000 VNĐ
- Nozzle 50x50mm : 1,125,000 VNĐ
- Nozzle 55x55mm : 1,125,000 VNĐ
- Nozzle 60x60mm : 1,125,000 VNĐ
- Nozzle 65x65mm : 1,125,000 VNĐ

1, This machine adopts industrial computer control, full automatic vision alignment system can acquire BGA and the PCB image through the CCD camera and collect them on the image positioning processing system, calculate the offset position and angle through image processing software, then re-transmission to motor drive of servo controller to correct the position, thus completing the BGA placement. Fast response, positioning accuracy is up to ±0.005 MM,with keyboard, mouse and 15 inch HD LCD monitor.
2,  During mounting, the machine can automatically analyze, search, modify the location of BGA or PCB, and through the nozzle to automatically pick up BGA and mount it to the specified pad, When desoldering, it can automatically remove the BGA on PCB and place it to the specified location.
3,  The upper heater can be moved freely, the system X, Y-axis and R angle are used Panasonic servo control system, optical alignment, can be 360 degrees rotated, automatically positioning, automatic error correction system, so that the PIN bit on BGA and PCB pad fully matched.
4, Mounting speed can be controlled according to work requirements.
5, Top heater head and mounting head independent design prevent the suction pen from deformation by hot air. Z-axis movements are controlled by Panasonic servo system which can accurately control the site and ho tspots, different size of BGA nozzle, 360 degree rotation, easy to install and replace. Customized is available.
6,  There are 3 independent heaters. The 1st and 2nd hot-air heaters can control multiple groups and segments temperature parameters. The 3rd large area IR heater can preheat the PCB board fully to ensure no deformation to the board. Temperature, time, slope, cooling, alarming all can be displayed on the touch screen.
7, High-precision K-type thermocouple with closed loop control, PID auto-tuning system temperature system, combined with Panasonic PLC and highly sensitive temperature module for the precise temperature control, the temperature error controlled within ± 1 degree, The external 5 sensors can detect temperature precisely, analyze and calibrate the real temperature curve accurately.
8, V-groove PCB support, rapid positioning, convenience, accuracy, can fit for all kinds of PCB board.
9,  Flexible and removable universal fixture has protective effects and no damage to the PCB board, suitable for all kinds of BGA repair.
10,  Mounting, welding and dewelding process are intelligent controlled and work automatically, BGA mounting position is controlled accurately, after desoldering and soldering, there is alarming. When temperature goes out of control, the circuit will automatically power off.
11,  It can save memory 1000 sets of temperature parameters of BGA chips positioning points and sites. Can analyze and modify the temperature parameters on the touch screen at any time, display and store 8 temperature curves and multiple sets of user data. It can analyze the movement curve instantly.
12,   Powerful cross-flow fan to cool the PCB automatically after desoldering and soldering, it prevent the deformation of PCB board to ensure the welding effect.
13,  The emissions generated during welding can be automatically discharged, to ensure the operator health and environmental protection.
14, Equipped with pressure and optical sensors to control the pressure in 3-10 grams and optical switches, so that it can automatically recognize the suction chip and mounting height, to ensure not crush BGA chip, It can repair Socket775 and double BGA / CGA / IC and various shielding devices, meet the requirement of lead-free process.
15, Welding machine is equipped with the purifier built-in through C.A.T south of patent technology development Co., CACF activated carbon filter material, can effectively absorb soldering smoke, carbon dioxide gas and Organic smell, the gas purifying efficiency reach to 99.7%. The seal-off fan chamber is equipped with sound-absorbing material, It could ensure that the equipment quietly work. In a word, It’s compact structure, small size, convenient use.
16, The machine is equipped with process monitoring camera, can clearly observe the technology  process of solder ball while heating, ensure a high and reliable welding effect.

1

 

Total Power

9800W

2

Top heater

1200W

3

Bottom heater

2nd  heater 1200W,3rd IR heater 7200W

4

power

AC220V±10%     50/60Hz

5

Dimensions

1100*1300*1700mm(LCD stand not included)

6

Positioning

V-groove PCB support,and with external universal fixture

7

Temperature control

K-type thermocouple (Closed Loop), heating independently, temperature precision within ±1 degree

8

PCB size

Max 500*600mm  Min 10*20 mm

9

Electrical materials

Servo Drive( Panasonic)+Industrial Host+ Heating plate(Germany)

10

Optical system

Servo Drive+ Automatic Vision Alignment System(Panasonic)

11

BGA chip

2×2-80×80mm

12

External temperature sensor

five

13

Work Mode

Computer intelligence operations

14

Placement Accuracy

X, Y axis and the R angle with micrometer adjust, servo drive, accuracy within ±0.005MM

15

Net weight

400kg

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