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FISCHER FISCHERSCOPE X-RAY XDV-µ Coating Thickness Meter (Ø 20 µm Standard*)

Simultaneous measurement of up to 24 elements, from Al(13) to U(92), XDV-μ LD: S(16)-U(92)

Advanced polycapillary optics that focuses the X-ray beam down to 10 μm (FWHM) for measuring on microstructures

Programmable XY stage and pattern recognition for automatic measurements on multiple samples

Extending sample stage for easy positioning of the sample

Guided calibration process

Robust design for long-term use

Optical microscope (270x magnification) with video, laser pointer to show the exact measuring spot

Fundamental parameter analysis for measurements without calibration

Complies with IPC-4552A, 4553B, 4554 and 4556, ASTM B568, ISO 3497

Fischer's certified standards are traceable to internationally recognized base units

Details

Applications

Au/Pd/Ni/CuFe and Sn/Ni coatings in the micro- and nanometer range

Assembled and unassembled circuit boards

Testing of base metallization layers (under-bump metallization, UBM) in the nanometer range

Measurement of light elements, e.g. determination of the phosphorus content (in ENEIG/ENEPIG) under Au and Pd

Lead-free solder caps on copper pillars

Testing the elemental composition of C4 and smaller solder bumps, as well as small contact surfaces in the semiconductor industry

Brochure


  • Quality Engagement
  • Easy change and return
  • Delivery Avaliable
  • Favorable payment

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